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TRI Announces New Wafer Inspection and Metrology Platform
TRI introduced the TR7950Q SII platform for wafer inspection and metrology in back-end process and advanced packaging. The report highlights AVI, SWIR, high-resolution imaging and metrology tasks for TSV, wafer surface inspection and chiplet-oriented production flows. For the SMT market, this is another marker of expanding the boundaries of the industry, where inspection suppliers are already working much wider than just within the PCBA framework. Original source: SMTA Source link: https://smta.org/news/726216/TRI-Announces-New-Wafer-Inspection-and-Metrology-Platform.htm
Koh Young Brings True3D Metrology to Advanced Packaging at ECTC 2026
Koh Young has brought its True3D approach to advanced packaging and metrology for more complex semiconductor assemblies. The publication shows how the experience gained in SMT inspection is used in the tasks of heterogeneous integration and wafer-level packaging. This is an important transition for the market: inspection suppliers are increasingly working at the intersection of electronics assembly and semiconductor packaging. Original source: Koh Young America Source link: https://kohyoungamerica.com/koh-young-ectc-2026-advanced-packaging/
APEX EXPO 2026 Highlights Advanced Electronic Packaging
The announcement of APEX EXPO 2026 highlighted advanced electronic packaging as one of the central themes of the exhibition and conference. The publication deals with advanced packaging, SMT, reliability and the tasks of automotive, aerospace and high-performance electronics. This is important for the SMT audience because the boundary between classic board assembly and packaging/metrology is becoming less and less rigid. Original source: Global Electronics Association Source link: https://www.electronics.org/news-release/apex-expo-2026-flagship-event-global-electronics-association-showcases-future-advanced