TRI introduced the TR7950Q SII platform for wafer inspection and metrology in back-end process and advanced packaging.
The report highlights AVI, SWIR, high-resolution imaging and metrology tasks for TSV, wafer surface inspection and chiplet-oriented production flows.
For the SMT market, this is another marker of expanding the boundaries of the industry, where inspection suppliers are already working much wider than just within the PCBA framework.
Original source: SMTA
Source link: https://smta.org/news/726216/TRI-Announces-New-Wafer-Inspection-and-Metrology-Platform.htm