The announcement of APEX EXPO 2026 highlighted advanced electronic packaging as one of the central themes of the exhibition and conference.
The publication deals with advanced packaging, SMT, reliability and the tasks of automotive, aerospace and high-performance electronics.
This is important for the SMT audience because the boundary between classic board assembly and packaging/metrology is becoming less and less rigid.
Original source: Global Electronics Association
Source link: https://www.electronics.org/news-release/apex-expo-2026-flagship-event-global-electronics-association-showcases-future-advanced