Koh Young has brought its True3D approach to advanced packaging and metrology for more complex semiconductor assemblies.
The publication shows how the experience gained in SMT inspection is used in the tasks of heterogeneous integration and wafer-level packaging.
This is an important transition for the market: inspection suppliers are increasingly working at the intersection of electronics assembly and semiconductor packaging.
Original source: Koh Young America
Source link: https://kohyoungamerica.com/koh-young-ectc-2026-advanced-packaging/