Materials
Apr 28, 2026
KOKI Expands Low-Ag Solder Portfolio to Reduce Material Costs While Maintaining Reliability
KOKI has expanded its Low-Ag solder materials line in response to silver price volatility. The company is positioning new materials as a way to reduce cost without sacrificing process stability and assembly reliability requirements. This is practical news for SMT manufacturers: cost pressure on materials remains high, so alternatives to standard alloys are becoming increasingly relevant. Original source: SMTA Source link: https://smta.org/news/726217/KOKI-Expands-Low-Ag-Solder-Portfolio-to-Reduce-Material-Costs-While-Maintaining-Reliability.htm
SMTA