KOKI has expanded its Low-Ag solder materials line in response to silver price volatility.
The company is positioning new materials as a way to reduce cost without sacrificing process stability and assembly reliability requirements.
This is practical news for SMT manufacturers: cost pressure on materials remains high, so alternatives to standard alloys are becoming increasingly relevant.
Original source: SMTA
Source link: https://smta.org/news/726217/KOKI-Expands-Low-Ag-Solder-Portfolio-to-Reduce-Material-Costs-While-Maintaining-Reliability.htm