Overview
The Puma is a state-of-the-art pick-and-place and dispensing system designed for high-speed and flexibility. It features modular and adaptive technology, allowing it to grow with customer requirements.
What It Is / Where It Fits
- High-speed pick-and-place solution
- Ultraflexible and rapid prototyping development
- Expandable in any direction
- Common modular and adaptive in various environments
- Supports different modules for growing with customer requirements
- Pick-and-place and dispensing capabilities
- High-speed placement
- Solder paste jetting
- Jet-on-the-fly functionality
Notable Capabilities
- Optimum placement speed: up to 30,000 cph (4-axes), 17,400 cph (2-axes), and 9,000 cph (1-axis)
- Solder paste jetting with shockwave jet valve
- Max frequency: 1,100,000 dots/h
- BGA pattern speed: 665,000 dots/h
- Average board speed: 350,000 dots/h
- Feeder capacity: 280 (160 inline), 260 (140 inline)
- Component size range: 008004 (imp.) - 109 x 87 mm
- Placement accuracy: ±40 μm (3σ) for chip, ±30 μm (3σ) for QFP
Options / Integration
- Expandable with different modules
- Supports 8 mm tape feeders
- Max PCB dimensions: 560 x 610 mm (22 x 24“) or optional 1,800 x 610 mm (71 x 24“)
- Machine footprint: 1,557 x 1,357 mm (61 x 53“)
Key Specifications
| Specification | Value |
|---|---|
| Placement Speed (4-axes) | 30,000 cph |
| Placement Speed (2-axes) | 17,400 cph |
| Placement Speed (1-axis) | 9,000 cph |
| Max Frequency | 1,100,000 dots/h |
| BGA Pattern Speed | 665,000 dots/h |
| Average Board Speed | 350,000 dots/h |