Review: Yamaha Hybrid Placer YRH10 / YRH10W
The YRH10 / YRH10W is Yamaha’s hybrid placer engineered for mixed mounting of semiconductor die and standard SMD components in a single platform, making it especially effective for high-mix module production where line footprint, changeover time, and placement integrity must be tightly controlled. By combining hybrid mounting mechanics with a load-cell-controlled placement process, the platform targets both throughput and high-accuracy requirements, delivering up to 14,000 UPH (wafer) and 29,000 CPH (chip) with ±15 μm placement accuracy (Cpk ≥ 1.0) according to Yamaha specifications.
Key Features
- Hybrid mounting concept: supports both SMD and semiconductor die mounting on one machine to reduce inter-process handoffs, floor space, and capital cost for mixed-technology assemblies.
- Load-cell controlled placement: reduces the risk of component damage and scattering by monitoring placement force in real time during sensitive die operations.
- Optimized mounting operation: workflow and head/feeder utilization designed to keep cycle time stable across mixed supply patterns and pallet-based module builds.
- Stable accuracy over time: mechanisms and compensation strategies aimed at maintaining high mounting accuracy regardless of PCB condition changes or long operating shifts.
- Preventive failure avoidance: in-process checks designed to reduce mounting errors before they propagate downstream (scrap reduction and higher first-pass yield).
- High versatility with reduced labor: simplified changeover work to reduce operator workload and improve repeatability across frequent product swaps.
- “Any time / Skill-less” supply concept: component supply and setup design intended to reduce reliance on highly skilled operators during changeover.
- Production support functions: features focused on reducing non-value-added time (setup, verification, adjustment) to keep module production moving.
- YRH10W dedicated features: compatible with 12-inch wafers and enhanced productivity with large and heavy PCB conveyance for module substrates.
Technical Specifications
| Specification | YRH10 | YRH10W |
|---|---|---|
| Die size | L0.2 × W0.2 mm to L16 × W16 mm | L0.35 × W0.35 mm to L16 × W16 mm |
| Die thickness | 0.1 to 0.5 mm | |
| Wafer size | 6 / 8 inch | 6 / 8 / 12 inch |
| SMD component size | 0201 to L16 × W16 mm, Height 15 mm or less | |
| Tape size | 8 to 104 mm | |
| Wafer mounting capacity | 14,000 UPH | |
| Chip mounting capacity | 29,000 CPH | |
| Mounting accuracy | ±15 μm (Cpk ≥ 1.0) | |
| Number of component types | Reel: max. 48 types, Wafer: max. 10 types | Reel: max. 64 types, Wafer: max. 10 types |
| Applicable PCB | L50 × W30 mm to L330 × W250 mm | L50 × W60 mm to L510 × W460 mm |
| PCB thickness / Max. carrying weight | 0.1 to 4.0 mm / 1 kg | 0.8 to 20 mm / 10 kg |
| Power supply | 3-Phase AC 200/208/220/240/380/400/416 V ±10%, 50/60 Hz | |
| Air supply source | Over 0.45 MPa, clean and dry state | |
| External dimension | L1,252 × W1,962 × H1,853 mm | L1,374 × W2,602 × H1,849 mm |
| Weight | Approx. 1,560 kg | Approx. 2,635 kg |