Review: ViTrox V310i Optimus 3D SPI
Revolutionary high speed 3D SPI Solution is designed to cater for the PCB manufacturing process by ensuring high quality solder paste deposition from printer. Through real-time analysis and adaptive control, our V310i 3D SPI Solution ensures solder paste deposition meets the standard and enables users to achieve impeccable PCBA quality, reduced defects, and increased yields.
Key Features
- Effortless programming through intelligent parameter setting and machine learning feature
- High speed performance true 3D SPI system in the market
- High-resolution high-speed 3D imaging technology
- Best reliable 3D SPI system with accurate and precise solder paste measurement
- Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI)
- Smart manufacturing ready with collaboration with Solder Paste Printers and Pick-and-Place equipments
- Preferred choice of Top EMS Companies
Technical Specifications
| V310i Optimus 3D | SMT PCB Assembly Smart 3D SPI System Inquire Customer Testimonials Overview Revolutionary high speed 3D SPI Solution is designed to cater for the PCB manufacturing process by ensuring high quality solder paste deposition from printer. Through real-time analysis and adaptive control, our V310i 3D SPI Solution ensures solder paste deposition meets the standard and enables users to achieve impeccable PCBA quality, reduced defects, and increased yields. Key Features Effortless programming through intelligent parameter setting and machine learning feature High speed performance true 3D SPI system in the market High-resolution high-speed 3D imaging technology Best reliable 3D SPI system with accurate and precise solder paste measurement Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI) Smart manufacturing ready with collaboration with Solder Paste Printers and Pick-and-Place equipments Preferred choice of Top EMS Companies Learn More |
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| Specification | System Performances Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured System Hardware 12MP 4MP Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Default: 40mm x 40mm @ 20µm telecentric lens Inspection Speed 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec 4MP CameraLink @ 20µm Resolution: Up to 55cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology Lighting Module Concurrent RGB Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 510mm x 510mm (20" x 20") ** Option: 450mm x 510mm (17.7" x 20") *** DL Equal: 510mm x 235mm (20" x 9.2") ** Single Lane: 510mm x 420mm (20" x 16.5") ** Option: DL Equal: 450mm x 235mm (17.7" x 9.2") *** Single Lane: 450mm x 420mm (17.7" x 16.5") *** Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 510mm x 503mm (20" x 19.8") ** Option: 450mm x 503mm (17.7" x 19.8") *** DL Equal: 510mm x 228mm (20" x 8.9") ** Single Lane: 510mm x 413mm (20" x 16.2") ** Option: DL Equal: 450mm x 228mm (17.7" x 8.9") *** Single Lane: 450mm x 413mm (17.7" x 16.2") *** Maximum PCB Thickness 4mm (0.15") 4mm (0.15") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 3kg 3kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 70mm 70mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1060mm x 1353mm x 2111mm Total System Weight ~900kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement N/A Remark * Based on system configuration. ** with extended casing *** without extended casing Specifications are subject to change. |
| System Performances | Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured System Hardware 12MP 4MP Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Default: 40mm x 40mm @ 20µm telecentric lens Inspection Speed 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec 4MP CameraLink @ 20µm Resolution: Up to 55cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology Lighting Module Concurrent RGB Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 510mm x 510mm (20" x 20") ** Option: 450mm x 510mm (17.7" x 20") *** DL Equal: 510mm x 235mm (20" x 9.2") ** Single Lane: 510mm x 420mm (20" x 16.5") ** Option: DL Equal: 450mm x 235mm (17.7" x 9.2") *** Single Lane: 450mm x 420mm (17.7" x 16.5") *** Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 510mm x 503mm (20" x 19.8") ** Option: 450mm x 503mm (17.7" x 19.8") *** DL Equal: 510mm x 228mm (20" x 8.9") ** Single Lane: 510mm x 413mm (20" x 16.2") ** Option: DL Equal: 450mm x 228mm (17.7" x 8.9") *** Single Lane: 450mm x 413mm (17.7" x 16.2") *** Maximum PCB Thickness 4mm (0.15") 4mm (0.15") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 3kg 3kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 70mm 70mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1060mm x 1353mm x 2111mm Total System Weight ~900kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement N/A Remark * Based on system configuration. ** with extended casing *** without extended casing Specifications are subject to change. |
| Inspection Functions | Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. |
| Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured |
| System Hardware | 12MP 4MP |
| Operating System | Windows 10 (64-bit) |
| Optical Resolution & FOV Size * | Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Default: 40mm x 40mm @ 20µm telecentric lens |
| Inspection Speed | 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec 4MP CameraLink @ 20µm Resolution: Up to 55cm²/sec |
| 3D Technologies | Phase Shift Profilometry (PSP) Methodology |
| Lighting Module | Concurrent RGB Lighting Module |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA |
| PCB Dimension | Standard FDL |
| Maximum PCB Size (L x W) | 510mm x 510mm (20" x 20") ** Option: 450mm x 510mm (17.7" x 20") *** DL Equal: 510mm x 235mm (20" x 9.2") ** Single Lane: 510mm x 420mm (20" x 16.5") ** Option: DL Equal: 450mm x 235mm (17.7" x 9.2") *** Single Lane: 450mm x 420mm (17.7" x 16.5") *** |
| Minimum PCB Size (L x W) | 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") |
| Maximum PCB Inspectable Area (L x W) | 510mm x 503mm (20" x 19.8") ** Option: 450mm x 503mm (17.7" x 19.8") *** DL Equal: 510mm x 228mm (20" x 8.9") ** Single Lane: 510mm x 413mm (20" x 16.2") ** Option: DL Equal: 450mm x 228mm (17.7" x 8.9") *** Single Lane: 450mm x 413mm (17.7" x 16.2") *** |
| Maximum PCB Thickness | 4mm (0.15") 4mm (0.15") |
| Minimum PCB Thickness | 0.5mm (0.02") 0.5mm (0.02") |
| Maximum PCB Weight | 3kg 3kg |
| Top Clearance of PCB | 50mm 50mm |
| Bottom Clearance of PCB | 70mm 70mm |
| PCB Edge Clearance | 3.5mm 3.5mm |
| PCB Transport Height | 890mm - 965mm |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. |
| System Footprint (Width X Depth X Height) | 1060mm x 1353mm x 2111mm |
| Total System Weight | ~900kgs |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase |
| Air Requirement | N/A |
| Remark | * Based on system configuration. ** with extended casing *** without extended casing Specifications are subject to change. |