Review: ViTrox V310i SPI for Advanced Packaging and Microelectronics
Revolutionary high speed 3D SPI system for advanced packaging and microelectronics that resolve challenging and miniature defects detection with automation and flexibility.
Key Features
- Effortless programming through intelligent parameter setting and machine learning feature
- High speed performance true 3D SPI system in the market
- High-resolution 3D imaging technology for micro-level solder paste inspection
- Unique inspection capabilities for advanced packaging (SiP, leadframe and solder bump)
- Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI)
- Smart manufacturing ready with collaboration with Solder Paste Printers and Pick-and-Place equipments
- Preferred choice of Top EMS Companies
Technical Specifications
| V310i SPI for Advanced Packaging and Microelectronics | Backend Semiconductor Smart 3D SPI System Inquire Customer Testimonials Overview Revolutionary high speed 3D SPI system for advanced packaging and microelectronics that resolve challenging and miniature defects detection with automation and flexibility. Key Features Effortless programming through intelligent parameter setting and machine learning feature High speed performance true 3D SPI system in the market High-resolution 3D imaging technology for micro-level solder paste inspection Unique inspection capabilities for advanced packaging (SiP, leadframe and solder bump) Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI) Smart manufacturing ready with collaboration with Solder Paste Printers and Pick-and-Place equipments Preferred choice of Top EMS Companies Learn More |
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| Specification | System Performances Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume, Bridge and Micro Bridge. Extended Capabilities: Leadframe Inspection, Solder Bump Inspection, SiP Inspection. Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured System Hardware Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * 25MP CoaXPress Camera @ 4.5μm telecentric lens Inspection Speed 25MP CoaXPress @ 4.5µm Resolution: 7-15cm²/sec 3D Technologies Phase Shift Profilometry’s (PSP) Methodology Lighting Module Multi-Segment LED Lighting Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA Board Dimension Standard Maximum Board Size (L x W) 470mm x 500mm (18.5" x 19.6") Minimum Board Size (L x W) 50mm x 50mm (2" x 2") Maximum Board Inspectable Area (L x W) 470mm x 493mm (18.5" x 19.4") Maximum Board Thickness 4mm (0.15") Minimum Board Thickness 0.2mm (0.00787") Maximum PCB Weight 3kg Top Clearance of PCB 10mm Bottom Clearance of PCB 70mm PCB Edge Clearance 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System footprint (Width X Depth X Height) 1060mm x 1353mm x 2111mm Total System Weight ~900kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Specifications are subject to change. |
| System Performances | Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume, Bridge and Micro Bridge. Extended Capabilities: Leadframe Inspection, Solder Bump Inspection, SiP Inspection. Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured System Hardware Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * 25MP CoaXPress Camera @ 4.5μm telecentric lens Inspection Speed 25MP CoaXPress @ 4.5µm Resolution: 7-15cm²/sec 3D Technologies Phase Shift Profilometry’s (PSP) Methodology Lighting Module Multi-Segment LED Lighting Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA Board Dimension Standard Maximum Board Size (L x W) 470mm x 500mm (18.5" x 19.6") Minimum Board Size (L x W) 50mm x 50mm (2" x 2") Maximum Board Inspectable Area (L x W) 470mm x 493mm (18.5" x 19.4") Maximum Board Thickness 4mm (0.15") Minimum Board Thickness 0.2mm (0.00787") Maximum PCB Weight 3kg Top Clearance of PCB 10mm Bottom Clearance of PCB 70mm PCB Edge Clearance 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System footprint (Width X Depth X Height) 1060mm x 1353mm x 2111mm Total System Weight ~900kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Specifications are subject to change. |
| Inspection Functions | Missing, XY Offset, Solder Height, Solder Area, Solder Volume, Bridge and Micro Bridge. Extended Capabilities: Leadframe Inspection, Solder Bump Inspection, SiP Inspection. |
| Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured |
| Operating System | Windows 10 (64-bit) |
| Optical Resolution & FOV Size * | 25MP CoaXPress Camera @ 4.5μm telecentric lens |
| Inspection Speed | 25MP CoaXPress @ 4.5µm Resolution: 7-15cm²/sec |
| 3D Technologies | Phase Shift Profilometry’s (PSP) Methodology |
| Lighting Module | Multi-Segment LED Lighting |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA |
| Board Dimension | Standard |
| Maximum Board Size (L x W) | 470mm x 500mm (18.5" x 19.6") |
| Minimum Board Size (L x W) | 50mm x 50mm (2" x 2") |
| Maximum Board Inspectable Area (L x W) | 470mm x 493mm (18.5" x 19.4") |
| Maximum Board Thickness | 4mm (0.15") |
| Minimum Board Thickness | 0.2mm (0.00787") |
| Maximum PCB Weight | 3kg |
| Top Clearance of PCB | 10mm |
| Bottom Clearance of PCB | 70mm |
| PCB Edge Clearance | 3.5mm |
| PCB Transport Height | 890mm - 965mm |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. |
| System footprint (Width X Depth X Height) | 1060mm x 1353mm x 2111mm |
| Total System Weight | ~900kgs |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase |
| Air Requirement | 0.6 Mpa/85 psi |
| Remark | * Based on system configuration. Specifications are subject to change. |