Review: ViTrox V310i XL SPI
Revolutionary high speed V310i 3D SPI Solution is designed to cater for the PCB manufacturing process by ensuring high quality solder paste deposition from the printer. The V310i XL system supports large board inspection with extended size capabilities for large board up to 460mm x 690mm (18.1" x 27.2"). Through real-time analysis and adaptive control, our V310i 3D SPI Solution ensures solder paste deposition meets the standard and enables users to achieve impeccable PCBA quality, reduced defects, and increased yields.
Key Features
- Effortless programming through intelligent parameter setting and machine learning feature
- High speed performance 3D SPI system in the market
- High-resolution 3D imaging technology
- Best reliable 3D SPI system with accurate and precise solder paste measurement
- Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI)
- Smart manufacturing ready with collaboration with Solder Paste Printers and Pick-and-Place equipments
- Preferred choice of Top EMS Companies
Technical Specifications
| V310i XL | SMT PCB Assembly Smart 3D SPI System Inquire Customer Testimonials Overview Revolutionary high speed V310i 3D SPI Solution is designed to cater for the PCB manufacturing process by ensuring high quality solder paste deposition from the printer. The V310i XL system supports large board inspection with extended size capabilities for large board up to 460mm x 690mm (18.1" x 27.2"). Through real-time analysis and adaptive control, our V310i 3D SPI Solution ensures solder paste deposition meets the standard and enables users to achieve impeccable PCBA quality, reduced defects, and increased yields. Key Features Effortless programming through intelligent parameter setting and machine learning feature High speed performance 3D SPI system in the market High-resolution 3D imaging technology Best reliable 3D SPI system with accurate and precise solder paste measurement Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI) Smart manufacturing ready with collaboration with Solder Paste Printers and Pick-and-Place equipments Preferred choice of Top EMS Companies Learn More |
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| Specification | System Performances Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured System Hardware 12MP 4MP Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Default: 40mm x 40mm @ 20µm telecentric lens Inspection Speed 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec 4MP CameraLink @ 20µm Resolution: Up to 55cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology Lighting Module Concurrent RGB Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 460mm x 690mm (18.1" x 27.2") DL Equal: 460mm x 325mm (18.1" x 12.8") Single Lane: 460mm x 600mm (18.1" x 23.6") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 460mm x 683mm (18.1" x 26.8") DL Equal: 460mm x 318mm (18.1" x 12.5") Single Lane: 460mm x 593mm (18.1" x 23.3") Maximum PCB Thickness 7mm (0.27") 7mm (0.27") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 3kg 3kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 100mm 100mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1060mm x 1440mm x 2116mm Total System Weight ~960kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Specifications are subject to change. |
| System Performances | Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured System Hardware 12MP 4MP Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Default: 40mm x 40mm @ 20µm telecentric lens Inspection Speed 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec 4MP CameraLink @ 20µm Resolution: Up to 55cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology Lighting Module Concurrent RGB Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 460mm x 690mm (18.1" x 27.2") DL Equal: 460mm x 325mm (18.1" x 12.8") Single Lane: 460mm x 600mm (18.1" x 23.6") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 460mm x 683mm (18.1" x 26.8") DL Equal: 460mm x 318mm (18.1" x 12.5") Single Lane: 460mm x 593mm (18.1" x 23.3") Maximum PCB Thickness 7mm (0.27") 7mm (0.27") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 3kg 3kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 100mm 100mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1060mm x 1440mm x 2116mm Total System Weight ~960kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Specifications are subject to change. |
| Inspection Functions | Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. |
| Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured |
| System Hardware | 12MP 4MP |
| Operating System | Windows 10 (64-bit) |
| Optical Resolution & FOV Size * | Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Default: 40mm x 40mm @ 20µm telecentric lens |
| Inspection Speed | 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 12MP CameraLink @ 15µm Resolution: Up to 60cm²/sec 4MP CameraLink @ 20µm Resolution: Up to 55cm²/sec |
| 3D Technologies | Phase Shift Profilometry (PSP) Methodology |
| Lighting Module | Concurrent RGB Lighting Module |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA |
| PCB Dimension | Standard FDL |
| Maximum PCB Size (L x W) | 460mm x 690mm (18.1" x 27.2") DL Equal: 460mm x 325mm (18.1" x 12.8") Single Lane: 460mm x 600mm (18.1" x 23.6") |
| Minimum PCB Size (L x W) | 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") |
| Maximum PCB Inspectable Area (L x W) | 460mm x 683mm (18.1" x 26.8") DL Equal: 460mm x 318mm (18.1" x 12.5") Single Lane: 460mm x 593mm (18.1" x 23.3") |
| Maximum PCB Thickness | 7mm (0.27") 7mm (0.27") |
| Minimum PCB Thickness | 0.5mm (0.02") 0.5mm (0.02") |
| Maximum PCB Weight | 3kg 3kg |
| Top Clearance of PCB | 50mm 50mm |
| Bottom Clearance of PCB | 100mm 100mm |
| PCB Edge Clearance | 3.5mm 3.5mm |
| PCB Transport Height | 890mm - 965mm |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. |
| System Footprint (Width X Depth X Height) | 1060mm x 1440mm x 2116mm |
| Total System Weight | ~960kgs |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase |
| Air Requirement | 0.6 Mpa/85 psi |
| Remark | * Based on system configuration. Specifications are subject to change. |