Review: ViTrox V810Ai S2 XLW AXI
Award-winning Smart 3D AXI System Solution is designed specifically for the PCB manufacturing process. The V810Ai S2 XLW system is the largest platform among the Smart 3D AXI System Series, featuring with the latest vision technologies and designed to supports large and heavy board up to 1320.8mm x 1320.8mm (52" x 52") and weighing up to 25kg. Equipped with high-resolution X-ray imaging technology and AI capabilities, the Smart 3D AXI System Solution excels in hidden defect detection through comprehensive test coverage, high accuracy and high-speed performance.
Key Features
- World Top Leading High Speed 3D AXI Solution
- AI integrated to automate process for enhanced accuracy and efficiency
- Powerful and Robust AI test algorithms with comprehensive test component coverage for complicated inspection requirement
- High-resolution X-ray imaging for complex components inspection (heavily shaded and non-uniformly shaded component)
- Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI)
- Preferred choice of Top EMS Companies
- Smart manufacturing ready
Technical Specifications
| V810Ai S2 XLW | SMT PCB Assembly Smart 3D AXI System Inquire Customer Testimonials Overview Award-winning Smart 3D AXI System Solution is designed specifically for the PCB manufacturing process. The V810Ai S2 XLW system is the largest platform among the Smart 3D AXI System Series, featuring with the latest vision technologies and designed to supports large and heavy board up to 1320.8mm x 1320.8mm (52" x 52") and weighing up to 25kg. Equipped with high-resolution X-ray imaging technology and AI capabilities, the Smart 3D AXI System Solution excels in hidden defect detection through comprehensive test coverage, high accuracy and high-speed performance. Key Features World Top Leading High Speed 3D AXI Solution AI integrated to automate process for enhanced accuracy and efficiency Powerful and Robust AI test algorithms with comprehensive test component coverage for complicated inspection requirement High-resolution X-ray imaging for complex components inspection (heavily shaded and non-uniformly shaded component) Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI) Preferred choice of Top EMS Companies Smart manufacturing ready Learn More |
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| Specification | System controller Integrated controller with 8 Core Intel Xeon processors Operating system Windows 10 (64-bit) Test Development Environment User interface Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels Off-line test development software Optional for off-line PC CAD conversion tool Support 4 different types of CAD in V810Ai software and optional software available to translate other CAD data to ViTrox's format Typical test development time 4 hours to 1.5 days to convert raw CAD file and develop application Line Integration Transport heights 865mm - 1025mm Line communication standard SMEMA, HERMES Barcode readers Compatible with most industry standard barcode readers Performance Parameters False Call rate 500 - 1000ppm Minimum features detection capability Joint pitch¹ 0.3mm and above Short width² 0.045mm Solder thickness 0.0127mm Allowable Panel Characteristics Maximum PCB Size (L x W) 1320.8mm x 1320.8mm (52" x 52") Minimum PCB Size (L x W) 127mm x 127mm (5" x 5") Maximum PCB inspectable area 1320.8mm x 1300.48mm (52" x 51.2") * Full board inspection with external rotator Maximum PCB thickness 10mm (393mils) Minimum PCB thickness 1.524mm (60mils) PCB warp Downward < 2mm, Upward < 1mm (without PSP); Downward < 3mm, Upward < 1.5mm (with PSP) Maximum PCB weight 25kg Top Clearance of PCB 50mm @ 19µm resolution 31mm @ 15µm resolution 14mm @ 11µm resolution (Calculated from Board Top surface) Bottom Clearance of PCB 80mm PCB edge clearance 10mm 100% Press-fit testability Yes (With PSP2 / PSP2.1 feature) PCB Temperature 40⁰C Safety Standards X-ray radiation leakage is below 0.5 µSv/hr Installation Specification Power Supplies 200 – 240 VAC three phase; 380 – 415 VAC three phase wye (+/- 5) (50Hz or 60Hz) Air requirement 828kPA (120psi) compressed air System footprint (Width X Depth X Height) 3300mm x 3300mm x 1990mm Total system weight ~11000kgs Remark *Note 1: 1. Assuming pad width is 50% of pitch. 2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board. 2x2 Binning Mode (hardware upgrade is required) **Note 2: 1. Panels are supported and transported along their width edges. For panels with edge cutouts, a carrier may be required to ensure proper handling and stability during the process. 2. The maximum panel size dimensions and weight must include carrier if applicable. 3. Smaller panels can be accommodated for testing with the use of panel carriers. 4. The imaging results may be affected by the layout of the surface-mounted components, depending on the thickness of the panel. 5. Bottom of the panel is the reference for the measurements including the maximum warpage. |
| System controller | Integrated controller with 8 Core Intel Xeon processors |
| Operating system | Windows 10 (64-bit) |
| User interface | Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels |
| Off-line test development software | Optional for off-line PC |
| CAD conversion tool | Support 4 different types of CAD in V810Ai software and optional software available to translate other CAD data to ViTrox's format |
| Typical test development time | 4 hours to 1.5 days to convert raw CAD file and develop application |
| Transport heights | 865mm - 1025mm |
| Line communication standard | SMEMA, HERMES |
| Barcode readers | Compatible with most industry standard barcode readers |
| False Call rate | 500 - 1000ppm |
| Joint pitch¹ | 0.3mm and above |
| Short width² | 0.045mm |
| Solder thickness | 0.0127mm |
| Maximum PCB Size (L x W) | 1320.8mm x 1320.8mm (52" x 52") |
| Minimum PCB Size (L x W) | 127mm x 127mm (5" x 5") |
| Maximum PCB inspectable area | 1320.8mm x 1300.48mm (52" x 51.2") * Full board inspection with external rotator |
| Maximum PCB thickness | 10mm (393mils) |
| Minimum PCB thickness | 1.524mm (60mils) |
| PCB warp | Downward < 2mm, Upward < 1mm (without PSP); Downward < 3mm, Upward < 1.5mm (with PSP) |
| Maximum PCB weight | 25kg |
| Top Clearance of PCB | 50mm @ 19µm resolution 31mm @ 15µm resolution 14mm @ 11µm resolution (Calculated from Board Top surface) |
| Bottom Clearance of PCB | 80mm |
| PCB edge clearance | 10mm |
| 100% Press-fit testability | Yes (With PSP2 / PSP2.1 feature) |
| PCB Temperature | 40⁰C |
| Safety Standards | X-ray radiation leakage is below 0.5 µSv/hr |
| Power Supplies | 200 – 240 VAC three phase; 380 – 415 VAC three phase wye (+/- 5) (50Hz or 60Hz) |
| Air requirement | 828kPA (120psi) compressed air |
| System footprint (Width X Depth X Height) | 3300mm x 3300mm x 1990mm |
| Total system weight | ~11000kgs |
| Remark | *Note 1: 1. Assuming pad width is 50% of pitch. 2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board. 2x2 Binning Mode (hardware upgrade is required) **Note 2: 1. Panels are supported and transported along their width edges. For panels with edge cutouts, a carrier may be required to ensure proper handling and stability during the process. 2. The maximum panel size dimensions and weight must include carrier if applicable. 3. Smaller panels can be accommodated for testing with the use of panel carriers. 4. The imaging results may be affected by the layout of the surface-mounted components, depending on the thickness of the panel. 5. Bottom of the panel is the reference for the measurements including the maximum warpage. |