Review: ViTrox V810Ai S3 AXI
Award-winning Smart 3D AXI System Solution is designed specifically for the PCB manufacturing process. The V810Ai S3 system with dual lane solution is the pioneer 3D AXI in the market, achieving high throughput with up to ~50% faster cycle time while the regular version speeds up ~20-30% compared to its successor. Equipped with high-resolution X-ray imaging technology and AI capabilities, the Smart 3D AXI System Solution excels in hidden defect detection through comprehensive test coverage, high accuracy and high-speed performance.
Key Features
- World Top Leading High Speed 3D AXI Solution
- Market's Pioneer AXI Dual Lane Solution for high throughput and cycle time enhancement
- AI integrated to automate process for enhanced accuracy and efficiency
- Powerful and Robust AI test algorithms with comprehensive test component coverage for complicated inspection requirement
- High-resolution X-ray imaging for complex components inspection (heavily shaded and non-uniformly shaded component)
- Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI)
- Preferred choice of Top EMS Companies
- Smart manufacturing ready
Technical Specifications
| V810Ai S3 | SMT PCB Assembly Smart 3D AXI System Inquire Customer Testimonials Overview Award-winning Smart 3D AXI System Solution is designed specifically for the PCB manufacturing process. The V810Ai S3 system with dual lane solution is the pioneer 3D AXI in the market, achieving high throughput with up to ~50% faster cycle time while the regular version speeds up ~20-30% compared to its successor. Equipped with high-resolution X-ray imaging technology and AI capabilities, the Smart 3D AXI System Solution excels in hidden defect detection through comprehensive test coverage, high accuracy and high-speed performance. Key Features World Top Leading High Speed 3D AXI Solution Market's Pioneer AXI Dual Lane Solution for high throughput and cycle time enhancement AI integrated to automate process for enhanced accuracy and efficiency Powerful and Robust AI test algorithms with comprehensive test component coverage for complicated inspection requirement High-resolution X-ray imaging for complex components inspection (heavily shaded and non-uniformly shaded component) Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI) Preferred choice of Top EMS Companies Smart manufacturing ready Learn More |
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| Specification | System controller Integrated controller with 8 Core Intel Xeon processors Operating system Windows 10 (64-bit) Test Development Environment User interface Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels Off-line test development software Optional for off-line PC CAD conversion tool Support 4 different types of CAD in V810Ai software and optional software available to translate other CAD data to ViTrox's format Typical test development time 4 hours to 1.5 days to convert raw CAD file and develop application Line Integration Transport heights 865mm - 1025mm Line communication standard SMEMA, HERMES Barcode readers Compatible with most industry standard barcode readers Performance Parameters False Call rate 500 - 1000ppm Minimum features detection capability Joint pitch¹ 0.3mm and above Short width² 0.045mm Solder thickness 0.0127mm Allowable Panel Characteristics Standard DL Maximum PCB Size (L x W) 725.0mm x 482.6mm (28.5" x 19") Dual Lane: 490mm x 206mm (19.2" x 8.1") Single Lane: 490mm x 400mm (19.2" x 15.7") Minimum PCB Size (L x W) 63.5mm x 63.5mm (2.5" x 2.5") 63.5mm x 76.2mm (2.5" x 3") Maximum PCB inspectable area 725.0mm x 474.9mm (28.5" x 18.7") Dual Lane: 490mm x 200mm (19.2" x 7.9") Single Lane: 490mm x 394mm (19.2" x 15.5") Maximum PCB thickness 7mm (275mils) 5mm (196mils) Minimum PCB thickness 0.508mm (20mils) PCB warp Downward < 3.3mm; Upward < 3.3mm Maximum PCB weight 4.5kg Top Clearance of PCB 50mm @ 22µm resolution 42mm @ 19µm resolution 26mm @ 15µm resolution 11mm @ 12µm resolution 26mm @ 10µm resolution11mm @ 7µm resolution(calculated from board top surface) Bottom Clearance of PCB 80mm 40mm PCB edge clearance 3mm 3mm 100% Press-fit testability Yes (With PSP2 / PSP2.1 feature) PCB Temperature 40⁰C Safety Standards X-ray radiation leakage is below 0.5 µSv/hr Installation Specification Power Supplies 200 – 240 VAC three phase; 380 – 415 VAC three phase wye (+/- 5) (50Hz or 60Hz) Air requirement 552kPA (80psi) System footprint (Width X Depth X Height) 1835mm x 2185mm x 2162mm Total system weight ~4800kgs ~4850kgs Remark *Note 1: 1. Assuming pad width is 50% of pitch. 2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board. 2x2 Binning Mode (hardware upgrade is required) **Note 2: 1. Panels are supported and transported along their width edges. For panels with edge cutouts, a carrier may be required to ensure proper handling and stability during the process. 2. The maximum panel size dimensions and weight must include carrier if applicable. 3. Smaller panels can be accommodated for testing with the use of panel carriers. 4. The imaging results may be affected by the layout of the surface-mounted components, depending on the thickness of the panel. 5. Bottom of the panel is the reference for the measurements including the maximum warpage. |
| System controller | Integrated controller with 8 Core Intel Xeon processors |
| Operating system | Windows 10 (64-bit) |
| User interface | Microsoft Windows based software solution with easy-to-use GUI and password-protected user levels |
| Off-line test development software | Optional for off-line PC |
| CAD conversion tool | Support 4 different types of CAD in V810Ai software and optional software available to translate other CAD data to ViTrox's format |
| Typical test development time | 4 hours to 1.5 days to convert raw CAD file and develop application |
| Transport heights | 865mm - 1025mm |
| Line communication standard | SMEMA, HERMES |
| Barcode readers | Compatible with most industry standard barcode readers |
| False Call rate | 500 - 1000ppm |
| Joint pitch¹ | 0.3mm and above |
| Short width² | 0.045mm |
| Solder thickness | 0.0127mm |
| Allowable Panel Characteristics | Standard DL |
| Maximum PCB Size (L x W) | 725.0mm x 482.6mm (28.5" x 19") Dual Lane: 490mm x 206mm (19.2" x 8.1") Single Lane: 490mm x 400mm (19.2" x 15.7") |
| Minimum PCB Size (L x W) | 63.5mm x 63.5mm (2.5" x 2.5") 63.5mm x 76.2mm (2.5" x 3") |
| Maximum PCB inspectable area | 725.0mm x 474.9mm (28.5" x 18.7") Dual Lane: 490mm x 200mm (19.2" x 7.9") Single Lane: 490mm x 394mm (19.2" x 15.5") |
| Maximum PCB thickness | 7mm (275mils) 5mm (196mils) |
| Minimum PCB thickness | 0.508mm (20mils) |
| PCB warp | Downward < 3.3mm; Upward < 3.3mm |
| Maximum PCB weight | 4.5kg |
| Top Clearance of PCB | 50mm @ 22µm resolution 42mm @ 19µm resolution 26mm @ 15µm resolution 11mm @ 12µm resolution 26mm @ 10µm resolution11mm @ 7µm resolution(calculated from board top surface) |
| Bottom Clearance of PCB | 80mm 40mm |
| PCB edge clearance | 3mm 3mm |
| 100% Press-fit testability | Yes (With PSP2 / PSP2.1 feature) |
| PCB Temperature | 40⁰C |
| Safety Standards | X-ray radiation leakage is below 0.5 µSv/hr |
| Power Supplies | 200 – 240 VAC three phase; 380 – 415 VAC three phase wye (+/- 5) (50Hz or 60Hz) |
| Air requirement | 552kPA (80psi) |
| System footprint (Width X Depth X Height) | 1835mm x 2185mm x 2162mm |
| Total system weight | ~4800kgs ~4850kgs |
| Remark | *Note 1: 1. Assuming pad width is 50% of pitch. 2. The reported values for minimum feature detection assume that the feature is in a single plane of focus and that there are no X-ray absorbers in the X-ray path or in the immediate area of the feature other than those found in a typical multi-layer printed circuit board. 2x2 Binning Mode (hardware upgrade is required) **Note 2: 1. Panels are supported and transported along their width edges. For panels with edge cutouts, a carrier may be required to ensure proper handling and stability during the process. 2. The maximum panel size dimensions and weight must include carrier if applicable. 3. Smaller panels can be accommodated for testing with the use of panel carriers. 4. The imaging results may be affected by the layout of the surface-mounted components, depending on the thickness of the panel. 5. Bottom of the panel is the reference for the measurements including the maximum warpage. |