Review: ViTrox V310i OP XXL
The V310i OP XXL is a high-speed 3D SPI solution designed specifically for the PCB manufacturing process. Equipped with large PCB handling capabilities up to 1200mm x 690mm (47.2" x 27.2"). Through real-time analysis and AI-powered inspection, V310i OP XXL ensures precise solder paste deposition, reduced defects, and improved PCBA yields.
Key Features
- High-performance 3D inspection
- Comprehensive test coverage with advanced 3D rendering images
- Accurate 3D height measurement, up to 3000µm for glue inspection
- High-resolution 12MP CoaXPress camera with 15µm telecentric lens (optional 13µm / 10µm / 8µm)
- Cost-effective common platform with AOI machines for shared design and spare parts utilization
- Equipped with AI-powered algorithm such as AI Foreign Material Detection providing lower false call rate
Technical Specifications
| V310i OP XXL | SMT PCB Assembly Smart 3D SPI System Inquire Customer Testimonials Overview The V310i OP XXL is a high-speed 3D SPI solution designed specifically for the PCB manufacturing process. Equipped with large PCB handling capabilities up to 1200mm x 690mm (47.2" x 27.2"). Through real-time analysis and AI-powered inspection, V310i OP XXL ensures precise solder paste deposition, reduced defects, and improved PCBA yields. Key Features High-performance 3D inspection Comprehensive test coverage with advanced 3D rendering images Accurate 3D height measurement, up to 3000µm for glue inspection High-resolution 12MP CoaXPress camera with 15µm telecentric lens (optional 13µm / 10µm / 8µm) Cost-effective common platform with AOI machines for shared design and spare parts utilization Equipped with AI-powered algorithm such as AI Foreign Material Detection providing lower false call rate Learn More |
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| Specification | System Performances Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. Board Level Traceability Camera-Read Barcodes; External Barcode Reader Configured System Hardware Operating System Windows 10 or above (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Inspection Speed 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology Lighting Module Concurrent RGB Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 620mm x 690mm (24.4" x 27.2") Option: 960mm x 690mm (37.8" x 27.2") 1200mm x 690mm (47.2" x 27.2") DL Equal: 620mm x 325mm (24.4" x 12.8") Single Lane: 620mm x 600mm (24.4" x 23.6") Option: DL Equal: 800mm x 325mm (31.49"x 12.8") Single Lane: 800mm x 600mm (31.49"x 23.6") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 620mm x 683mm (24.4" x 26.9") Option: 960mm x 683mm (37.8" x 26.9") 1200mm x 683mm (47.2" x 26.9") DL Equal: 620mm x 318mm (24.4" x 12.5") Single Lane: 620mm x 593mm (24.4" x 23.3") Option: DL Equal: 800mm x 318mm (31.49"x 12.5") Single Lane: 800mm x 593mm (31.49"x 23.3") Maximum PCB Thickness 15mm (0.59") 8mm (0.31") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 7kg (Option: 15kg) 7kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 100mm 100mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1410mm x 1600mm x 2209mm Total System Weight ~1180kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. ** with extended casing *** without extended casing Specifications are subject to change. |
| System Performances | Inspection Functions Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. Board Level Traceability Camera-Read Barcodes; External Barcode Reader Configured System Hardware Operating System Windows 10 or above (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Inspection Speed 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology Lighting Module Concurrent RGB Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 620mm x 690mm (24.4" x 27.2") Option: 960mm x 690mm (37.8" x 27.2") 1200mm x 690mm (47.2" x 27.2") DL Equal: 620mm x 325mm (24.4" x 12.8") Single Lane: 620mm x 600mm (24.4" x 23.6") Option: DL Equal: 800mm x 325mm (31.49"x 12.8") Single Lane: 800mm x 600mm (31.49"x 23.6") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 620mm x 683mm (24.4" x 26.9") Option: 960mm x 683mm (37.8" x 26.9") 1200mm x 683mm (47.2" x 26.9") DL Equal: 620mm x 318mm (24.4" x 12.5") Single Lane: 620mm x 593mm (24.4" x 23.3") Option: DL Equal: 800mm x 318mm (31.49"x 12.5") Single Lane: 800mm x 593mm (31.49"x 23.3") Maximum PCB Thickness 15mm (0.59") 8mm (0.31") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 7kg (Option: 15kg) 7kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 100mm 100mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1410mm x 1600mm x 2209mm Total System Weight ~1180kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. ** with extended casing *** without extended casing Specifications are subject to change. |
| Inspection Functions | Missing, XY Offset, Solder Height, Solder Area, Solder Volume and Bridge. |
| Board Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured |
| Operating System | Windows 10 or above (64-bit) |
| Optical Resolution & FOV Size * | Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens |
| Inspection Speed | 12MP CoaXPress @ 15µm Resolution: Up to 94cm²/sec |
| 3D Technologies | Phase Shift Profilometry (PSP) Methodology |
| Lighting Module | Concurrent RGB Lighting Module |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA |
| PCB Dimension | Standard FDL |
| Maximum PCB Size (L x W) | 620mm x 690mm (24.4" x 27.2") Option: 960mm x 690mm (37.8" x 27.2") 1200mm x 690mm (47.2" x 27.2") DL Equal: 620mm x 325mm (24.4" x 12.8") Single Lane: 620mm x 600mm (24.4" x 23.6") Option: DL Equal: 800mm x 325mm (31.49"x 12.8") Single Lane: 800mm x 600mm (31.49"x 23.6") |
| Minimum PCB Size (L x W) | 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") |
| Maximum PCB Inspectable Area (L x W) | 620mm x 683mm (24.4" x 26.9") Option: 960mm x 683mm (37.8" x 26.9") 1200mm x 683mm (47.2" x 26.9") DL Equal: 620mm x 318mm (24.4" x 12.5") Single Lane: 620mm x 593mm (24.4" x 23.3") Option: DL Equal: 800mm x 318mm (31.49"x 12.5") Single Lane: 800mm x 593mm (31.49"x 23.3") |
| Maximum PCB Thickness | 15mm (0.59") 8mm (0.31") |
| Minimum PCB Thickness | 0.5mm (0.02") 0.5mm (0.02") |
| Maximum PCB Weight | 7kg (Option: 15kg) 7kg |
| Top Clearance of PCB | 50mm 50mm |
| Bottom Clearance of PCB | 100mm 100mm |
| PCB Edge Clearance | 3.5mm 3.5mm |
| PCB Transport Height | 890mm - 965mm |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. |
| System Footprint (Width X Depth X Height) | 1410mm x 1600mm x 2209mm |
| Total System Weight | ~1180kgs |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase |
| Air Requirement | 0.6 Mpa/85 psi |
| Remark | * Based on system configuration. ** with extended casing *** without extended casing Specifications are subject to change. |