Review: ViTrox V510i AOI for Advanced Packaging and Microelectronics AOI
Next generation 3D AOI for advanced packaging that resolves challenging inspection with automation and flexibility.
Key Features
- High speed performance 3D AOI system provides high accuracy and reliable inspection performance with real 3D measurement
- High accuracy 3D inspection image for mirror components and reflective die
- Unique test coverage for advanced packaging application (Lead frame inspection, die, and wire bond inspection) and mirror/reflective components
- Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI)
- Preferred choice of Top EMS Companies
- Smart manufacturing ready
Technical Specifications
| V510i AOI for Advanced Packaging and Microelectronics | Backend Semiconductor Smart 3D AOI System Inquire Customer Testimonials Overview Next generation 3D AOI for advanced packaging that resolves challenging inspection with automation and flexibility. Key Features High speed performance 3D AOI system provides high accuracy and reliable inspection performance with real 3D measurement High accuracy 3D inspection image for mirror components and reflective die Unique test coverage for advanced packaging application (Lead frame inspection, die, and wire bond inspection) and mirror/reflective components Real-time closed-loop and data cross referencing among ViTrox solutions (SPI to AXI) Preferred choice of Top EMS Companies Smart manufacturing ready Learn More |
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| Specification | System Performances Inspection Functions • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate) • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc). • Gold Pad/Finger Surface Inspection • Foreign Material Detection • Coordinates Measurement • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate) • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc). • Wire bond inspection: Missing Wire, Broken Wire, Sagging/Shifted Wire, Off Pad Bonding, Ball Bond Diameter, Shorted Wire, Wrong Bond • Gold Pad/Finger Surface Inspection • Foreign Material Detection • Coordinates Measurement Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging System Hardware 25MP 25MP Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * 44.2mm x 44.2mm @ 9μm telecentric lens 34.4mm x 34.4mm @ 7µm telecentric lens 29.5mm x 29.5mm @ 6µm telecentric lens 24.6mm x 24.6mm @ 5μm telecentric lens 12.3mm x 12.3mm @ 2.5μm telecentric lens Inspection Speed 25MP CoaXPress @ 9μm resolution: Up to 27.9cm²/sec 25MP CoaXPress @ 7μm resolution: Up to 16.9cm²/sec 25MP CoaXPress @ 6μm resolution: Up to 12.4cm²/sec 25MP CoaXPress @ 5μm resolution: Up to 8.6cm²/sec 25MP CoaXPress @ 2.5μm resolution: Up to 2.2cm²/sec 3D Technologies True 3D Inspection with Phase Shift Profilometry (PSP) Methodology with 4-way projectors Lighting Module Built-in Coaxial Lighting Module, Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA Board Dimension Maximum Board Size (L x W) 490mm x 510mm (19.2" x 20") 470mm x 500mm (18.5" x 19.6") Minimum Board Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 490mm x 503mm (19.3" x 19.8") 470mm x 493mm (18.5" x 19.4") Maximum PCB Thickness 4mm (0.15") 4mm (0.15") Minimum PCB Thickness 0.2mm (0.00787") 0.2mm (0.00787") Maximum PCB Weight 3kg 3kg Top Clearance of PCB 35mm 10mm Bottom Clearance of PCB 70mm 70mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1060mm x 1353mm x 2111mm Total System Weight ~900kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Specifications are subject to change. |
| System Performances | Inspection Functions • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate) • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc). • Gold Pad/Finger Surface Inspection • Foreign Material Detection • Coordinates Measurement • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate) • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc). • Wire bond inspection: Missing Wire, Broken Wire, Sagging/Shifted Wire, Off Pad Bonding, Ball Bond Diameter, Shorted Wire, Wrong Bond • Gold Pad/Finger Surface Inspection • Foreign Material Detection • Coordinates Measurement Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging System Hardware 25MP 25MP Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * 44.2mm x 44.2mm @ 9μm telecentric lens 34.4mm x 34.4mm @ 7µm telecentric lens 29.5mm x 29.5mm @ 6µm telecentric lens 24.6mm x 24.6mm @ 5μm telecentric lens 12.3mm x 12.3mm @ 2.5μm telecentric lens Inspection Speed 25MP CoaXPress @ 9μm resolution: Up to 27.9cm²/sec 25MP CoaXPress @ 7μm resolution: Up to 16.9cm²/sec 25MP CoaXPress @ 6μm resolution: Up to 12.4cm²/sec 25MP CoaXPress @ 5μm resolution: Up to 8.6cm²/sec 25MP CoaXPress @ 2.5μm resolution: Up to 2.2cm²/sec 3D Technologies True 3D Inspection with Phase Shift Profilometry (PSP) Methodology with 4-way projectors Lighting Module Built-in Coaxial Lighting Module, Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA Board Dimension Maximum Board Size (L x W) 490mm x 510mm (19.2" x 20") 470mm x 500mm (18.5" x 19.6") Minimum Board Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 490mm x 503mm (19.3" x 19.8") 470mm x 493mm (18.5" x 19.4") Maximum PCB Thickness 4mm (0.15") 4mm (0.15") Minimum PCB Thickness 0.2mm (0.00787") 0.2mm (0.00787") Maximum PCB Weight 3kg 3kg Top Clearance of PCB 35mm 10mm Bottom Clearance of PCB 70mm 70mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1060mm x 1353mm x 2111mm Total System Weight ~900kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Specifications are subject to change. |
| Inspection Functions | • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate) • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc). • Gold Pad/Finger Surface Inspection • Foreign Material Detection • Coordinates Measurement • Mirror/Shiny/Reflective Component Surface (Lead Frame or Substrate) • Component Offset, Die Presence, Die Offset, Die Coplanarity, Die Chip-off/Crack, Die Orientation, and other Surface Defects on Die (Scratches, Contamination, etc). • Wire bond inspection: Missing Wire, Broken Wire, Sagging/Shifted Wire, Off Pad Bonding, Ball Bond Diameter, Shorted Wire, Wrong Bond • Gold Pad/Finger Surface Inspection • Foreign Material Detection • Coordinates Measurement |
| Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging |
| System Hardware | 25MP 25MP |
| Operating System | Windows 10 (64-bit) |
| Optical Resolution & FOV Size * | 44.2mm x 44.2mm @ 9μm telecentric lens 34.4mm x 34.4mm @ 7µm telecentric lens 29.5mm x 29.5mm @ 6µm telecentric lens 24.6mm x 24.6mm @ 5μm telecentric lens 12.3mm x 12.3mm @ 2.5μm telecentric lens |
| Inspection Speed | 25MP CoaXPress @ 9μm resolution: Up to 27.9cm²/sec 25MP CoaXPress @ 7μm resolution: Up to 16.9cm²/sec 25MP CoaXPress @ 6μm resolution: Up to 12.4cm²/sec 25MP CoaXPress @ 5μm resolution: Up to 8.6cm²/sec 25MP CoaXPress @ 2.5μm resolution: Up to 2.2cm²/sec |
| 3D Technologies | True 3D Inspection with Phase Shift Profilometry (PSP) Methodology with 4-way projectors |
| Lighting Module | Built-in Coaxial Lighting Module, Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA |
| Maximum Board Size (L x W) | 490mm x 510mm (19.2" x 20") 470mm x 500mm (18.5" x 19.6") |
| Minimum Board Size (L x W) | 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") |
| Maximum PCB Inspectable Area (L x W) | 490mm x 503mm (19.3" x 19.8") 470mm x 493mm (18.5" x 19.4") |
| Maximum PCB Thickness | 4mm (0.15") 4mm (0.15") |
| Minimum PCB Thickness | 0.2mm (0.00787") 0.2mm (0.00787") |
| Maximum PCB Weight | 3kg 3kg |
| Top Clearance of PCB | 35mm 10mm |
| Bottom Clearance of PCB | 70mm 70mm |
| PCB Edge Clearance | 3.5mm 3.5mm |
| PCB Transport Height | 890mm - 965mm |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. |
| System Footprint (Width X Depth X Height) | 1060mm x 1353mm x 2111mm |
| Total System Weight | ~900kgs |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase |
| Air Requirement | 0.6 Mpa/85 psi |
| Remark | * Based on system configuration. Specifications are subject to change. |