Review: ViTrox V510i SE XXL AOI
Award-winning Smart 3D AOI System Solution is designed specifically for the PCB manufacturing process. The V510i SE XXL system is the largest platform among the V510i AOI SE Series with the latest vision technologies, designed to supports extra large board inspection with extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2"). The cost-effective Smart 3D AOI System Solution provides high-resolution technology and AI-powered capabilities and excels in defect detection through comprehensive inspection coverage, high accuracy and high-speed performance.
Key Features
- High speed and accurate inspection with Real 3D Measurement
- AI-Powered technology for Automated, Smart, Easy and Quality Programming
- AI assisted auto defect buyoff (VVTS), offering >90% of judgement accuracy for effective labor and cost saving, minimizing human judgement error
- Unique and universal detection coverage for unconventional application
- AOI centralized control tower for machine performance tracking (yield, DPPM, FPPM) and remote program fine-tuning
- Cost-effective and ease of maintenance with 95% shareable parts between 3D AOI and 3D SPI similar machines
- Preferred choice of Top EMS Companies
- Smart manufacturing ready
Technical Specifications
| V510i SE XXL | SMT PCB Assembly Smart 3D AOI System Inquire Customer Testimonials Overview Award-winning Smart 3D AOI System Solution is designed specifically for the PCB manufacturing process. The V510i SE XXL system is the largest platform among the V510i AOI SE Series with the latest vision technologies, designed to supports extra large board inspection with extended size capabilities for extra large board sizes up to 1200mm x 690mm (47.2" x 27.2"). The cost-effective Smart 3D AOI System Solution provides high-resolution technology and AI-powered capabilities and excels in defect detection through comprehensive inspection coverage, high accuracy and high-speed performance. Key Features High speed and accurate inspection with Real 3D Measurement AI-Powered technology for Automated, Smart, Easy and Quality Programming AI assisted auto defect buyoff (VVTS), offering >90% of judgement accuracy for effective labor and cost saving, minimizing human judgement error Unique and universal detection coverage for unconventional application AOI centralized control tower for machine performance tracking (yield, DPPM, FPPM) and remote program fine-tuning Cost-effective and ease of maintenance with 95% shareable parts between 3D AOI and 3D SPI similar machines Preferred choice of Top EMS Companies Smart manufacturing ready Learn More |
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| Specification | System Performances Inspection Functions Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging System Hardware Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Inspection Speed 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology with 4-way projectors Lighting Module Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 620mm x 690mm (24.4" x 27.2") Option: 960mm x 690mm (37.8" x 27.2") 1200mm x 690mm (47.2" x 27.2") DL Equal: 620mm x 325mm (24.4" x 12.8") Single Lane: 620mm x 600mm (24.4" x 23.6") Option: DL Equal: 960mm x 325mm (37.8" x 12.8") Single Lane: 960mm x 600mm (37.8" x 23.6") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 620mm x 683mm (24.4" x 26.9") Option: 960mm x 683mm (37.8" x 26.9") 1200mm x 683mm (47.2" x 26.9") DL Equal: 620mm x 318mm (24.4" x 12.5") Single Lane: 620mm x 593mm (24.4" x 23.3") Option: DL Equal: 960mm x 318mm (37.8" x 12.5") Single Lane: 960mm x 593mm (37.8" x 23.3") Maximum PCB Thickness 15mm (0.59") 8mm (0.31") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 7kg (Option: 15kg) 7kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 100mm 100mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1410mm x 1600mm x 2209mm Total System Weight ~1180kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Note: 1. 2D configuration option is available. 2. 12MP Angle Camera option is available. Specifications are subject to change. |
| System Performances | Inspection Functions Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging System Hardware Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Inspection Speed 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology with 4-way projectors Lighting Module Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 620mm x 690mm (24.4" x 27.2") Option: 960mm x 690mm (37.8" x 27.2") 1200mm x 690mm (47.2" x 27.2") DL Equal: 620mm x 325mm (24.4" x 12.8") Single Lane: 620mm x 600mm (24.4" x 23.6") Option: DL Equal: 960mm x 325mm (37.8" x 12.8") Single Lane: 960mm x 600mm (37.8" x 23.6") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 620mm x 683mm (24.4" x 26.9") Option: 960mm x 683mm (37.8" x 26.9") 1200mm x 683mm (47.2" x 26.9") DL Equal: 620mm x 318mm (24.4" x 12.5") Single Lane: 620mm x 593mm (24.4" x 23.3") Option: DL Equal: 960mm x 318mm (37.8" x 12.5") Single Lane: 960mm x 593mm (37.8" x 23.3") Maximum PCB Thickness 15mm (0.59") 8mm (0.31") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 7kg (Option: 15kg) 7kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 100mm 100mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1410mm x 1600mm x 2209mm Total System Weight ~1180kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Note: 1. 2D configuration option is available. 2. 12MP Angle Camera option is available. Specifications are subject to change. |
| Inspection Functions | Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement |
| Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging |
| Operating System | Windows 10 (64-bit) |
| Optical Resolution & FOV Size * | Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens |
| Inspection Speed | 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec |
| 3D Technologies | Phase Shift Profilometry (PSP) Methodology with 4-way projectors |
| Lighting Module | Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module |
| Conveyor Width Adjustment | Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA |
| PCB Dimension | Standard FDL |
| Maximum PCB Size (L x W) | 620mm x 690mm (24.4" x 27.2") Option: 960mm x 690mm (37.8" x 27.2") 1200mm x 690mm (47.2" x 27.2") DL Equal: 620mm x 325mm (24.4" x 12.8") Single Lane: 620mm x 600mm (24.4" x 23.6") Option: DL Equal: 960mm x 325mm (37.8" x 12.8") Single Lane: 960mm x 600mm (37.8" x 23.6") |
| Minimum PCB Size (L x W) | 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") |
| Maximum PCB Inspectable Area (L x W) | 620mm x 683mm (24.4" x 26.9") Option: 960mm x 683mm (37.8" x 26.9") 1200mm x 683mm (47.2" x 26.9") DL Equal: 620mm x 318mm (24.4" x 12.5") Single Lane: 620mm x 593mm (24.4" x 23.3") Option: DL Equal: 960mm x 318mm (37.8" x 12.5") Single Lane: 960mm x 593mm (37.8" x 23.3") |
| Maximum PCB Thickness | 15mm (0.59") 8mm (0.31") |
| Minimum PCB Thickness | 0.5mm (0.02") 0.5mm (0.02") |
| Maximum PCB Weight | 7kg (Option: 15kg) 7kg |
| Top Clearance of PCB | 50mm 50mm |
| Bottom Clearance of PCB | 100mm 100mm |
| PCB Edge Clearance | 3.5mm 3.5mm |
| PCB Transport Height | 890mm - 965mm |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. |
| System Footprint (Width X Depth X Height) | 1410mm x 1600mm x 2209mm |
| Total System Weight | ~1180kgs |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase |
| Air Requirement | 0.6 Mpa/85 psi |
| Remark | * Based on system configuration. Note: 1. 2D configuration option is available. 2. 12MP Angle Camera option is available. Specifications are subject to change. |