Review: ViTrox V510Ai R AOI
Revolutionary Smart 3D AOI System platform with integrated 6-axis industrial robotic arm, providing flexibility for multi-angle inspection. It is the pioneer AOI platform that provides flexible 2-in-1 inspection capabilities for conformal coating and final assembly inspection within a single platform. * 3D functionality coming soon.
Key Features
- Highly flexible viewing angle utilizing 6-Axis industrial robotic arm for 3D inspection and measurement of partially hidden parts
- High speed 2-in-1 inspection capabilities (conformal coating and final assembly) to automate or replace Human Inspections
- Comprehensive 3D construction from multiple angles
- First Side Angle 3D AOI platform with comprehensive 3D image construction from angular view
- High speed performance 3D AOI system in market
- Preferred choice of Top EMS Companies
- Smart manufacturing ready
Technical Specifications
| V510Ai R | SMT PCB Assembly Smart 3D AOI System Inquire Customer Testimonials Overview Revolutionary Smart 3D AOI System platform with integrated 6-axis industrial robotic arm, providing flexibility for multi-angle inspection. It is the pioneer AOI platform that provides flexible 2-in-1 inspection capabilities for conformal coating and final assembly inspection within a single platform. * 3D functionality coming soon. Key Features Highly flexible viewing angle utilizing 6-Axis industrial robotic arm for 3D inspection and measurement of partially hidden parts High speed 2-in-1 inspection capabilities (conformal coating and final assembly) to automate or replace Human Inspections Comprehensive 3D construction from multiple angles First Side Angle 3D AOI platform with comprehensive 3D image construction from angular view High speed performance 3D AOI system in market Preferred choice of Top EMS Companies Smart manufacturing ready Learn More |
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| Specification | System Performances Inspection Functions Coating Splash, Bubbles, Insufficient, Foreign Object, Coating Scratch, O Peel, Missing Coating, Excess Coating, Coating on Connector, Keep-out-area, Coating Thickness Measurement Polarity/ Orientation, Absense/Presence, Knock-off, Component Chip-off, Foreign Object, PCB Exposed Copper, Assembly Inspection, Label Print Inspection, Label Quality Inspection, Connector Inspection Board and Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured System Hardware Operating System Windows 10 (64-bit) Computer System Intel i7-13700K, 32GB RAM, 1TB NVME M.2, 1TB HDD Camera and FOV Size 8MP Colour Camera, FOV 60mm x 60mm (default) Optical Resolution ~21μm/pixel Inspection Speed 2D: 8MP @ 21μm resolution: 80cm²/sec 3D Technologies Phase Shift Profilometry (PSP) methodology with 4-way projectors Lighting Module Multi-Angle Lighting & RGBW+UV Lighting X-Y-Z Axis Repeatabilty ±20μm Panel Dimension Maximum PCB Size (L x W) 600mm x 510mm (23.6" x 20") Option: 700mm x 510mm (27.5" x 20") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 600mm x 503mm (23.6" x 19.8") Option: 700mm x 503mm (27.5" x 19.8") Maximum PCB Thickness 13mm (0.51") Minimum PCB Thickness 0.5mm (0.01969") Maximum PCB Weight 15kg Top Clearance of PCB 120mm Bottom Clearance of PCB 120mm PCB Edge Clearance 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Thickness Measurement Minimum Thickness 25μm Installation Specification System Footprint (Width X Depth X Height) 1200mm x 1900mm x 1800mm Total System Weight ~700kg Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Note: 1. 3D configuration option is available. |
| System Performances | Inspection Functions Coating Splash, Bubbles, Insufficient, Foreign Object, Coating Scratch, O Peel, Missing Coating, Excess Coating, Coating on Connector, Keep-out-area, Coating Thickness Measurement Polarity/ Orientation, Absense/Presence, Knock-off, Component Chip-off, Foreign Object, PCB Exposed Copper, Assembly Inspection, Label Print Inspection, Label Quality Inspection, Connector Inspection Board and Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured System Hardware Operating System Windows 10 (64-bit) Computer System Intel i7-13700K, 32GB RAM, 1TB NVME M.2, 1TB HDD Camera and FOV Size 8MP Colour Camera, FOV 60mm x 60mm (default) Optical Resolution ~21μm/pixel Inspection Speed 2D: 8MP @ 21μm resolution: 80cm²/sec 3D Technologies Phase Shift Profilometry (PSP) methodology with 4-way projectors Lighting Module Multi-Angle Lighting & RGBW+UV Lighting X-Y-Z Axis Repeatabilty ±20μm Panel Dimension Maximum PCB Size (L x W) 600mm x 510mm (23.6" x 20") Option: 700mm x 510mm (27.5" x 20") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 600mm x 503mm (23.6" x 19.8") Option: 700mm x 503mm (27.5" x 19.8") Maximum PCB Thickness 13mm (0.51") Minimum PCB Thickness 0.5mm (0.01969") Maximum PCB Weight 15kg Top Clearance of PCB 120mm Bottom Clearance of PCB 120mm PCB Edge Clearance 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Thickness Measurement Minimum Thickness 25μm Installation Specification System Footprint (Width X Depth X Height) 1200mm x 1900mm x 1800mm Total System Weight ~700kg Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Note: 1. 3D configuration option is available. |
| Inspection Functions | Coating Splash, Bubbles, Insufficient, Foreign Object, Coating Scratch, O Peel, Missing Coating, Excess Coating, Coating on Connector, Keep-out-area, Coating Thickness Measurement Polarity/ Orientation, Absense/Presence, Knock-off, Component Chip-off, Foreign Object, PCB Exposed Copper, Assembly Inspection, Label Print Inspection, Label Quality Inspection, Connector Inspection |
| Board and Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured |
| Operating System | Windows 10 (64-bit) |
| Computer System | Intel i7-13700K, 32GB RAM, 1TB NVME M.2, 1TB HDD |
| Camera and FOV Size | 8MP Colour Camera, FOV 60mm x 60mm (default) |
| Optical Resolution | ~21μm/pixel |
| Inspection Speed | 2D: 8MP @ 21μm resolution: 80cm²/sec |
| 3D Technologies | Phase Shift Profilometry (PSP) methodology with 4-way projectors |
| Lighting Module | Multi-Angle Lighting & RGBW+UV Lighting |
| X-Y-Z Axis Repeatabilty | ±20μm |
| Maximum PCB Size (L x W) | 600mm x 510mm (23.6" x 20") Option: 700mm x 510mm (27.5" x 20") |
| Minimum PCB Size (L x W) | 50mm x 50mm (2" x 2") |
| Maximum PCB Inspectable Area (L x W) | 600mm x 503mm (23.6" x 19.8") Option: 700mm x 503mm (27.5" x 19.8") |
| Maximum PCB Thickness | 13mm (0.51") |
| Minimum PCB Thickness | 0.5mm (0.01969") |
| Maximum PCB Weight | 15kg |
| Top Clearance of PCB | 120mm |
| Bottom Clearance of PCB | 120mm |
| PCB Edge Clearance | 3.5mm |
| PCB Transport Height | 890mm - 965mm |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. |
| Minimum Thickness | 25μm |
| System Footprint (Width X Depth X Height) | 1200mm x 1900mm x 1800mm |
| Total System Weight | ~700kg |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase |
| Air Requirement | 0.6 Mpa/85 psi |
| Remark | * Based on system configuration. Note: 1. 3D configuration option is available. |