Review: ViTrox V510Ai ST AOI
Revolutionary Smart 3D AOI System platform designed to support 100mm tall component inspection. Equipped with high-resolution technology and AI-powered capabilities, the Smart 3D AOI System Solution excels in defect detection through comprehensive inspection coverage, high accuracy and high-speed performance.
Key Features
- High speed and accurate inspection with Real 3D Measurement
- AI-Powered technology for Automated, Smart, Easy and Quality programming and after-inspection judgement
- Support very tall component inspection coverage for top side (up to 100mm tall component)
- Unique and universal detection coverage for unconventional application
- Best test coverage with 3D rendering and angular inspection with angle camera
- AOI centralized control tower for machine performance tracking (yield, DPPM, FPPM) and remote program fine-tuning
- Preferred choice of Top EMS Companies
- Smart manufacturing ready
Technical Specifications
| V510Ai ST | SMT PCB Assembly Smart 3D AOI System Inquire Customer Testimonials Overview Revolutionary Smart 3D AOI System platform designed to support 100mm tall component inspection. Equipped with high-resolution technology and AI-powered capabilities, the Smart 3D AOI System Solution excels in defect detection through comprehensive inspection coverage, high accuracy and high-speed performance. Key Features High speed and accurate inspection with Real 3D Measurement AI-Powered technology for Automated, Smart, Easy and Quality programming and after-inspection judgement Support very tall component inspection coverage for top side (up to 100mm tall component) Unique and universal detection coverage for unconventional application Best test coverage with 3D rendering and angular inspection with angle camera AOI centralized control tower for machine performance tracking (yield, DPPM, FPPM) and remote program fine-tuning Preferred choice of Top EMS Companies Smart manufacturing ready Learn More |
|---|---|
| Specification | System Performances Inspection Functions Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging System Hardware Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens Inspection Speed 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology with 4-way projectors Lighting Module Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Top Clamping; In-line SMEMA Board Dimension Maximum Board Size (L x W) 510mm x 510mm (20" x 20") Option: 620mm x 510mm (24.4" x 20") Minimum Board Size (L x W) 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 510mm x 503mm (20" x 19.8") Option: 620mm x 503mm (24.4" x 19.8") Maximum PCB Thickness 10mm (0.39") Minimum PCB Thickness 0.5mm (0.02") Maximum PCB Weight 7kg Option: 15kg Top Clearance of PCB 100mm Bottom Clearance of PCB 100mm PCB Edge Clearance 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1160mm x 1491mm x 1913mm Total System Weight ~900kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Note: 1. 12MP Angle Camera option is available. Specifications are subject to change. |
| System Performances | Inspection Functions Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging System Hardware Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens Inspection Speed 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology with 4-way projectors Lighting Module Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Top Clamping; In-line SMEMA Board Dimension Maximum Board Size (L x W) 510mm x 510mm (20" x 20") Option: 620mm x 510mm (24.4" x 20") Minimum Board Size (L x W) 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 510mm x 503mm (20" x 19.8") Option: 620mm x 503mm (24.4" x 19.8") Maximum PCB Thickness 10mm (0.39") Minimum PCB Thickness 0.5mm (0.02") Maximum PCB Weight 7kg Option: 15kg Top Clearance of PCB 100mm Bottom Clearance of PCB 100mm PCB Edge Clearance 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1160mm x 1491mm x 1913mm Total System Weight ~900kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Note: 1. 12MP Angle Camera option is available. Specifications are subject to change. |
| Inspection Functions | Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement |
| Board & Component Level Traceability | Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging |
| Operating System | Windows 10 (64-bit) |
| Optical Resolution & FOV Size * | Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens |
| Inspection Speed | 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec |
| 3D Technologies | Phase Shift Profilometry (PSP) Methodology with 4-way projectors |
| Lighting Module | Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module |
| Conveyor Width Adjustment | Auto Width Adjustment; Top Clamping; In-line SMEMA |
| Maximum Board Size (L x W) | 510mm x 510mm (20" x 20") Option: 620mm x 510mm (24.4" x 20") |
| Minimum Board Size (L x W) | 50mm x 50mm (2" x 2") |
| Maximum PCB Inspectable Area (L x W) | 510mm x 503mm (20" x 19.8") Option: 620mm x 503mm (24.4" x 19.8") |
| Maximum PCB Thickness | 10mm (0.39") |
| Minimum PCB Thickness | 0.5mm (0.02") |
| Maximum PCB Weight | 7kg Option: 15kg |
| Top Clearance of PCB | 100mm |
| Bottom Clearance of PCB | 100mm |
| PCB Edge Clearance | 3.5mm |
| PCB Transport Height | 890mm - 965mm |
| PCB Temperature | Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. |
| System Footprint (Width X Depth X Height) | 1160mm x 1491mm x 1913mm |
| Total System Weight | ~900kgs |
| Power Supplies | 100-120V, 16A/200-240V, 8A Single Phase |
| Air Requirement | 0.6 Mpa/85 psi |
| Remark | * Based on system configuration. Note: 1. 12MP Angle Camera option is available. Specifications are subject to change. |