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AOI Systems ViTrox Official Apr 25, 2026

ViTrox V510i OP XXL

Review: ViTrox V510i OP XXLThe V510i OP XXL is a Smart 3D AOI system designed specifically for the PCB manufacturing process. With large PCB handling up to 620mm x 683mm (optional up to 1200mm x 683mm), equipped with high-resolution 3D vision, high-power...

Article Context
Category
AOI Systems
Source
ViTrox Official
Published
Apr 25, 2026

Review: ViTrox V510i OP XXL

The V510i OP XXL is a Smart 3D AOI system designed specifically for the PCB manufacturing process. With large PCB handling up to 620mm x 683mm (optional up to 1200mm x 683mm), equipped with high-resolution 3D vision, high-power projection technology, and AI-driven capabilities, the system delivers precise defect detection, accurate height measurement, and improved PCBA yield performance.

Key Features

  • High-performance 3D inspection
  • Comprehensive test coverage with advanced 3D rendering images
  • Accurate 3D height measurement
  • High-resolution 12MP CoaXPress camera with 15µm telecentric lens (optional 13µm / 10µm / 8µm)
  • 12MP side camera with 19µm fixed focal lens (option)
  • Cost-effective common platform with SPI machines for shared design and spare parts utilization
  • AI-powered Smart Programming and AI-assisted auto defect buy-off (VVTS) for intelligent inspection data judgement

Technical Specifications

V510i OP XXLSMT PCB Assembly Smart 3D AOI System Inquire Customer Testimonials Overview The V510i OP XXL is a Smart 3D AOI system designed specifically for the PCB manufacturing process. With large PCB handling up to 620mm x 683mm (optional up to 1200mm x 683mm), equipped with high-resolution 3D vision, high-power projection technology, and AI-driven capabilities, the system delivers precise defect detection, accurate height measurement, and improved PCBA yield performance. Key Features High-performance 3D inspection Comprehensive test coverage with advanced 3D rendering images Accurate 3D height measurement High-resolution 12MP CoaXPress camera with 15µm telecentric lens (optional 13µm / 10µm / 8µm) 12MP side camera with 19µm fixed focal lens (option) Cost-effective common platform with SPI machines for shared design and spare parts utilization AI-powered Smart Programming and AI-assisted auto defect buy-off (VVTS) for intelligent inspection data judgement Learn More
SpecificationSystem Performances Inspection Functions Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging System Hardware Operating System Windows 10 or above (64-bit) Optical Resolution & FOV Size * Default : 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Inspection Speed 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology with 4-way projectors Lighting Module Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 620mm x 690mm (24.4" x 27.2") Option: 960mm x 690mm (37.8" x 27.2") 1200mm x 690mm (47.2" x 27.2") DL Equal: 620mm x 325mm (24.4" x 12.8") Single Lane: 620mm x 600mm (24.4" x 23.6") Option: DL Equal: 800mm x 325mm (31.49"x 12.8") Single Lane: 800mm x 600mm (31.49"x 23.6") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 620mm x 683mm (24.4" x 26.9") Option: 960mm x 683mm (37.8" x 26.9") 1200mm x 683mm (47.2" x 26.9") DL Equal: 620mm x 318mm (24.4" x 12.5") Single Lane: 620mm x 593mm (24.4" x 23.3") Option: DL Equal: 800mm x 318mm (31.49"x 12.5") Single Lane: 800mm x 593mm (31.49"x 23.3") Maximum PCB Thickness 15mm (0.59") 8mm (0.31") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 7kg (Option: 15kg) 7kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 100mm 100mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1410mm x 1600mm x 2209mm Total System Weight ~1180kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Specifications are subject to change.
System PerformancesInspection Functions Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging System Hardware Operating System Windows 10 or above (64-bit) Optical Resolution & FOV Size * Default : 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Inspection Speed 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology with 4-way projectors Lighting Module Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 620mm x 690mm (24.4" x 27.2") Option: 960mm x 690mm (37.8" x 27.2") 1200mm x 690mm (47.2" x 27.2") DL Equal: 620mm x 325mm (24.4" x 12.8") Single Lane: 620mm x 600mm (24.4" x 23.6") Option: DL Equal: 800mm x 325mm (31.49"x 12.8") Single Lane: 800mm x 600mm (31.49"x 23.6") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 620mm x 683mm (24.4" x 26.9") Option: 960mm x 683mm (37.8" x 26.9") 1200mm x 683mm (47.2" x 26.9") DL Equal: 620mm x 318mm (24.4" x 12.5") Single Lane: 620mm x 593mm (24.4" x 23.3") Option: DL Equal: 800mm x 318mm (31.49"x 12.5") Single Lane: 800mm x 593mm (31.49"x 23.3") Maximum PCB Thickness 15mm (0.59") 8mm (0.31") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 7kg (Option: 15kg) 7kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 100mm 100mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1410mm x 1600mm x 2209mm Total System Weight ~1180kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Specifications are subject to change.
Inspection FunctionsMissing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement
Board & Component Level TraceabilityCamera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging
Operating SystemWindows 10 or above (64-bit)
Optical Resolution & FOV Size *Default : 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens
Inspection Speed12MP CoaXPress @ 15μm resolution: up to 64cm²/sec
3D TechnologiesPhase Shift Profilometry (PSP) Methodology with 4-way projectors
Lighting ModuleMultiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module
Conveyor Width AdjustmentAuto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
PCB DimensionStandard FDL
Maximum PCB Size (L x W)620mm x 690mm (24.4" x 27.2") Option: 960mm x 690mm (37.8" x 27.2") 1200mm x 690mm (47.2" x 27.2") DL Equal: 620mm x 325mm (24.4" x 12.8") Single Lane: 620mm x 600mm (24.4" x 23.6") Option: DL Equal: 800mm x 325mm (31.49"x 12.8") Single Lane: 800mm x 600mm (31.49"x 23.6")
Minimum PCB Size (L x W)50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2")
Maximum PCB Inspectable Area (L x W)620mm x 683mm (24.4" x 26.9") Option: 960mm x 683mm (37.8" x 26.9") 1200mm x 683mm (47.2" x 26.9") DL Equal: 620mm x 318mm (24.4" x 12.5") Single Lane: 620mm x 593mm (24.4" x 23.3") Option: DL Equal: 800mm x 318mm (31.49"x 12.5") Single Lane: 800mm x 593mm (31.49"x 23.3")
Maximum PCB Thickness15mm (0.59") 8mm (0.31")
Minimum PCB Thickness0.5mm (0.02") 0.5mm (0.02")
Maximum PCB Weight7kg (Option: 15kg) 7kg
Top Clearance of PCB50mm 50mm
Bottom Clearance of PCB100mm 100mm
PCB Edge Clearance3.5mm 3.5mm
PCB Transport Height890mm - 965mm
PCB TemperatureAmbient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
System Footprint (Width X Depth X Height)1410mm x 1600mm x 2209mm
Total System Weight~1180kgs
Power Supplies100-120V, 16A/200-240V, 8A Single Phase
Air Requirement0.6 Mpa/85 psi
Remark* Based on system configuration. Specifications are subject to change.

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