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AOI Systems ViTrox Official Apr 25, 2026

ViTrox V510i XL AOI

Review: ViTrox V510i XL AOIAward-winning Smart 3D AOI System Solution is designed specifically for the PCB manufacturing process. The V510i XL system supports large board inspection with extended size capabilities for large board sizes up to 460mm x 690mm...

Article Context
Category
AOI Systems
Source
ViTrox Official
Published
Apr 25, 2026

Review: ViTrox V510i XL AOI

Award-winning Smart 3D AOI System Solution is designed specifically for the PCB manufacturing process. The V510i XL system supports large board inspection with extended size capabilities for large board sizes up to 460mm x 690mm (18.1" x 27.2"). Equipped with high-resolution technology and AI-powered capabilities, the Smart 3D AOI System Solution excels in defect detection through comprehensive inspection coverage, high accuracy and high-speed performance.

Key Features

  • High speed and accurate inspection with Real 3D Measurement
  • AI-Powered technology for Automated, Smart, Easy and Quality Programming
  • AI assisted auto defect buyoff (VVTS), offering >90% of judgement accuracy for effective labor and cost saving, minimizing human judgement error
  • Unique and universal detection coverage for unconventional application
  • AOI centralized control tower for machine performance tracking (yield, DPPM, FPPM) and remote program fine-tuning
  • Cost-effective and ease of maintenance with 95% shareable parts between 3D AOI and 3D SPI similar machines
  • Preferred choice of Top EMS Companies
  • Smart manufacturing ready

Technical Specifications

V510i XLSMT PCB Assembly Smart 3D AOI System Inquire Customer Testimonials Overview Award-winning Smart 3D AOI System Solution is designed specifically for the PCB manufacturing process. The V510i XL system supports large board inspection with extended size capabilities for large board sizes up to 460mm x 690mm (18.1" x 27.2"). Equipped with high-resolution technology and AI-powered capabilities, the Smart 3D AOI System Solution excels in defect detection through comprehensive inspection coverage, high accuracy and high-speed performance. Key Features High speed and accurate inspection with Real 3D Measurement AI-Powered technology for Automated, Smart, Easy and Quality Programming AI assisted auto defect buyoff (VVTS), offering >90% of judgement accuracy for effective labor and cost saving, minimizing human judgement error Unique and universal detection coverage for unconventional application AOI centralized control tower for machine performance tracking (yield, DPPM, FPPM) and remote program fine-tuning Cost-effective and ease of maintenance with 95% shareable parts between 3D AOI and 3D SPI similar machines Preferred choice of Top EMS Companies Smart manufacturing ready Learn More
SpecificationSystem Performances Inspection Functions Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging System Hardware Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Inspection Speed 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology with 4-way projectors Lighting Module Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 460mm x 690mm (18.1" x 27.2") DL Equal: 460mm x 325mm (18.1" x 12.8") Single Lane: 460mm x 600mm (18.1" x 23.6") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 460mm x 683mm (18.1" x 26.9") DL Equal: 460mm x 318mm (18.1" x 12.5") Single Lane: 460mm x 593mm (18.1" x 23.3") Maximum PCB Thickness 7mm (0.27") 7mm (0.27") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 3kg 3kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 100mm 100mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1060mm x 1440mm x 2116mm Total System Weight ~960kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Note: 1. 2D configuration option is available. Specifications are subject to change.
System PerformancesInspection Functions Missing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement Board & Component Level Traceability Camera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging System Hardware Operating System Windows 10 (64-bit) Optical Resolution & FOV Size * Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens Inspection Speed 12MP CoaXPress @ 15μm resolution: up to 64cm²/sec 3D Technologies Phase Shift Profilometry (PSP) Methodology with 4-way projectors Lighting Module Multiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module Conveyor Width Adjustment Auto Width Adjustment; Bottom-Up Clamping; In-line SMEMA PCB Dimension Standard FDL Maximum PCB Size (L x W) 460mm x 690mm (18.1" x 27.2") DL Equal: 460mm x 325mm (18.1" x 12.8") Single Lane: 460mm x 600mm (18.1" x 23.6") Minimum PCB Size (L x W) 50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2") Maximum PCB Inspectable Area (L x W) 460mm x 683mm (18.1" x 26.9") DL Equal: 460mm x 318mm (18.1" x 12.5") Single Lane: 460mm x 593mm (18.1" x 23.3") Maximum PCB Thickness 7mm (0.27") 7mm (0.27") Minimum PCB Thickness 0.5mm (0.02") 0.5mm (0.02") Maximum PCB Weight 3kg 3kg Top Clearance of PCB 50mm 50mm Bottom Clearance of PCB 100mm 100mm PCB Edge Clearance 3.5mm 3.5mm PCB Transport Height 890mm - 965mm PCB Temperature Ambient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C. Installation Specification System Footprint (Width X Depth X Height) 1060mm x 1440mm x 2116mm Total System Weight ~960kgs Power Supplies 100-120V, 16A/200-240V, 8A Single Phase Air Requirement 0.6 Mpa/85 psi Remark * Based on system configuration. Note: 1. 2D configuration option is available. Specifications are subject to change.
Inspection FunctionsMissing, Offset, Skewed, Polarity, Billboard, Tombstone, Lifted/Bent Leads, Excess/Insufficient Solder, Overturn, Bridging, Wrong Part (OCV Marking), Pin Through Hole (Solderability & Pin Detection), Package Coplanarity, Lifted Lead (Height Measurement), Foreign Material Detection, Polarity Dimple Measurement
Board & Component Level TraceabilityCamera-Read Barcodes; External Barcode Reader Configured; OCR Capability with Batch Code Logging
Operating SystemWindows 10 (64-bit)
Optical Resolution & FOV Size *Default: 60mm x 45mm @ 15µm telecentric lens Option: 52mm x 39mm @ 13µm telecentric lens 40mm x 30mm @ 10μm telecentric lens 32mm x 24mm @ 8µm telecentric lens
Inspection Speed12MP CoaXPress @ 15μm resolution: up to 64cm²/sec
3D TechnologiesPhase Shift Profilometry (PSP) Methodology with 4-way projectors
Lighting ModuleMultiple Color, Multiple Angle, Multiple Segment LED Lighting Head, Auto Calibration Concurrent Lighting Module
Conveyor Width AdjustmentAuto Width Adjustment; Bottom-Up Clamping; In-line SMEMA
PCB DimensionStandard FDL
Maximum PCB Size (L x W)460mm x 690mm (18.1" x 27.2") DL Equal: 460mm x 325mm (18.1" x 12.8") Single Lane: 460mm x 600mm (18.1" x 23.6")
Minimum PCB Size (L x W)50mm x 50mm (2" x 2") 50mm x 50mm (2" x 2")
Maximum PCB Inspectable Area (L x W)460mm x 683mm (18.1" x 26.9") DL Equal: 460mm x 318mm (18.1" x 12.5") Single Lane: 460mm x 593mm (18.1" x 23.3")
Maximum PCB Thickness7mm (0.27") 7mm (0.27")
Minimum PCB Thickness0.5mm (0.02") 0.5mm (0.02")
Maximum PCB Weight3kg 3kg
Top Clearance of PCB50mm 50mm
Bottom Clearance of PCB100mm 100mm
PCB Edge Clearance3.5mm 3.5mm
PCB Transport Height890mm - 965mm
PCB TemperatureAmbient operating temperature is ~5⁰C to 40⁰C, maximum PCB temperature 80⁰C.
System Footprint (Width X Depth X Height)1060mm x 1440mm x 2116mm
Total System Weight~960kgs
Power Supplies100-120V, 16A/200-240V, 8A Single Phase
Air Requirement0.6 Mpa/85 psi
Remark* Based on system configuration. Note: 1. 2D configuration option is available. Specifications are subject to change.

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