Calculate aperture volume, area ratio, and solder mass with one process-ready workbench.
Use it for stencil design checks, paste-transfer discussions, and quick risk reads before printer trials or NPI reviews.
The effective area ratio tells you how easy paste release will be for the chosen stencil technology.
Transfer efficiency changes the paste that actually lands on the pad, not just the theoretical aperture volume.
Use red and amber states as a review signal, not as a substitute for print trials.
Process Notes
What AR Tells You
Area ratio is a release-risk indicator. Low AR often means transfer falls apart before stencil thickness or paste type can save the print.
What TE Tells You
Transfer efficiency controls what actually lands on the pad. Use measured TE whenever you have line data; estimated TE is only a planning shortcut.
Visualize Process Tradeoffs
Explore Combinations
Upload a CSV with RefDes, Package, Pad_L, and Pad_W to run a quick area-ratio screen against the current stencil settings.