BTU showed how its Aurora and Pyramax reflow platforms address thermal challenges in panel-level packaging and AI server assemblies.
The focus is on thermal uniformity, ultra-low oxygen processing and controlled heat and cool profiles for complex boards and packaging.
This is an indicator of how the requirements of AI server hardware and advanced packaging affect even the traditional reflow equipment segment.
Original source: SMTA
Source link: https://smta.org/news/724136/BTU-International-to-Highlight-Advanced-Reflow-Solutions-for-Panel-Level-Packaging-and-AI-Servers.htm